How manufacturers carry out the PCB assembly process?

Designing and development of PCB board comprise of many complex steps, which are necessary needed to carry out by experts. This is because of the complicatedness of the procedure, due to which it cannot be carried out by anyone, who is not skilled in this job.

Multiple stages are carried during the assembly service, which are discussed in detail in the document further.

Before heading on for the procedure, manufacturer jots down all the things that are needed to make it. Ordering of silicon, semiconductors and other necessary board things are collected. Once collection is done, process for the making of board is followed, which involves different steps. Following are few processes that are involved in PCB assembly services:

·      Binding of chips on board: Solder paste printing is the foremost step carried out by professionals. In other words, chips are bonded on the board by a pasting material.

·      Placement of chips on assembly line: Picking and placing of chips on the assembly line is done. The placement needs to be done perfectly on respective designed place so that device functioning is carried out appropriately.

·      Through-hole curing: In order to bind the chips properly on board, another method carried out immediately after soldering process is hole curing. Binding of chips is incomplete without this process, in order to solder it well on the PCB board.

·      Protective layer coating: To safeguard the board from dust, dirt and harmful material, a protective layer covering called conformal selective coating is to be done, once the soldering process is over. This process is carried out by machines in order to make a fine layer of covering on board.

·      AOI and AXI: Inspection is an important step to carry out, once the soldering, placement of chips, through-hole and protective layering is done. This step is carried out to ensure that everything has been done correctly and there are no flaws in the design of board. Automatic Optical Inspection and Automated X-ray Inspection are two methods to inspect the performance of board. 

·      Reconstruction: If during inspection, any defects occur, board is sent for reconstruction. During this process, all the steps that were carried out for the assembling of board are reversed back. The board is heated, chips are removed, and replacement of defected chips is done with the right ones.

Once the replacement is done properly, chips are soldered again and inspection process is carried out to ensure whether now the functioning of board is done properly or not.